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Inorganic and organic secondary components of electroplating baths

Organic and/or inorganic additives are included in electroplating baths to control the physical properties (ductility, hardness, tear strength, brazeability, etc.) of the deposited metal layer. In the case of decorative electroplating, the visual appearance of the surface is optimized with additives. Complexing agents are also added to baths to keep large quantities of metal in solution. 

Essentially, acids, bases and ions in low concentrations can be used to influence the nature of the surfaces of printed circuit boards, contacts, metal components etc.These bath additives must be analyzed at regular intervals, so the production process is most efficient and a consistent end product quality ensured.

Typical applications:

 Titration applications

Boric acid and tetrafluoroboric acid in nickel baths
Surfactant determination in electroplating baths
 
Ion chromatographic applications
Concentrated acids in etching solutions
Nitrate in nickel baths
Organic acids in electroplating baths
 
Voltammetric applications
Lead in nickel baths and further application examples
Antimony/bismuth in nickel baths
 
CVS and CPVS applications
CVS and CPVS to determine organic additives